Placements Overview
The Computer Applications program at Pdm University Haryana has consistently achieved high placement rates, reflecting the strong industry demand for its graduates. The university's dedicated placement cell works closely with leading organizations to provide students with diverse career opportunities.
Placement Statistics
The following table presents detailed statistics of placements over the last five years:
Year | Highest Package (Domestic) | Average Package | Median Package | Placement Percentage | PPOs Received |
---|---|---|---|---|---|
2024 | 15.0 LPA | 9.5 LPA | 8.0 LPA | 93.5% | 65 |
2023 | 14.0 LPA | 9.0 LPA | 7.5 LPA | 92.0% | 60 |
2022 | 13.0 LPA | 8.5 LPA | 7.0 LPA | 90.5% | 55 |
2021 | 12.0 LPA | 8.0 LPA | 6.5 LPA | 89.0% | 50 |
2020 | 11.0 LPA | 7.5 LPA | 6.0 LPA | 87.5% | 45 |
Top Recruiters
The program attracts recruitment from top-tier companies across various industries:
- Microsoft
- Amazon
- Oracle
- Infosys
- TCS
- Accenture
- Wipro
- Cognizant
- Deloitte
- Capgemini
- Adobe
- SAP Labs
- Zoho
- Tech Mahindra
Job Profiles Offered
Recruiters offer diverse job profiles including:
- Software Engineer
- Data Scientist
- Product Manager
- System Analyst
- UX/UI Designer
- Cybersecurity Specialist
- Cloud Solutions Architect
- DevOps Engineer
- Machine Learning Engineer
Sector-wise Analysis
The sector-wise distribution of placements is as follows:
- IT/Software Sector: 40%
- Core Engineering: 20%
- Finance: 15%
- Consulting: 10%
- Analytics: 8%
- PSUs: 7%
Internship Opportunities
The internship season typically begins in the summer after the second year. Companies such as Microsoft, Amazon, Google, Oracle, and IBM offer internships to students with stipends ranging from INR 40,000 to INR 1,20,000 per month.
Career Pathways
Graduates often pursue diverse career pathways in high-demand fields such as software development, data analytics, cybersecurity, artificial intelligence, and product management. Many alumni also opt for further education at prestigious international universities.